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[國(guó)外標(biāo)準(zhǔn)] RoHS豁免清單最新整理【中英文版】
P:2006-10-27 16:17:35
3
RoHS豁免清單最新整理【中英文版】
Applications of lead, mercury, cadmium and hexavalent chromium, which are exempted from the requirements of Article 4(1) ~/%}U^hIs
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. `[f$_Rt0oC
2. Mercury in straight fluorescent lamps for general purposes not exceeding: h
\WkC0
— halophosphate 10 mg
nj#} E-
— triphosphate with normal lifetime 5 mg A6* NUVWq
— triphosphate with long lifetime 8 mg. (Mti]`C_^
3. Mercury in straight fluorescent lamps for special purposes. ; Q9''hgR;~
4. Mercury in other lamps not specifically mentioned in this Annex. Hfm=Y]+;
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. -#j[1]q
XY+w
6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead wF3C*+mA
by weight and as a copper alloy containing up to 4 % lead by weight. 96Wq rK%
7. — Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), 7. q}''f=T
— lead in solders for servers, storage and storage array systems (exemption granted until 2010), YW ?,|[
— lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network 0h{>"9ME_
management for telecommunication, xw?Mr`
— lead in electronic ceramic parts (e.g. piezoelectronic devices). olZNjp,h
8. Cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) u p5$4rh
relating to restrictions on the marketing and use of certain dangerous substances and preparations. +bApE@q"G
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. E cfH_Vd0
10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for: a
X hH
— Deca BDE, 8a\< kf(Q
— mercury in straight fluorescent lamps for special purposes, FuX<Uew
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, S^id;
o
signalling, transmission as well as network management for telecommunications (with a view to setting a g2T!`‑
specific time limit for this exemption), and im
xZ eT
— light bulbs, "t;XV$[-B
as a matter of priority in order to establish as soon as possible whether these items are to be amended accordingly. r+tB
管理員 獎(jiǎng)勵(lì) 0 金幣，.7 聲望，于 2006-10-30 22:07:37
lightpack cable - 輕裝型電纜 （0） 投訴
P:2006-10-27 16:18:33
4
1．小型日光燈中的汞含量不得超過(guò)5毫克/燈； +
g7 +
2．一般用途的直管日光燈中的汞含量不得超過(guò)： YZ:2]
nH~
- 鹽磷酸鹽 10毫克 D &xOJII
- 正常的三磷酸鹽 5毫克 5;KV)#C2
- 長(zhǎng)效的三磷酸鹽 8毫克 0UCjB\D,G
3．特殊用途的直管日光燈中的汞含量； HaZ- jd9;
4．本附錄中未特別提及的其它照明燈中的汞含量； 4^xM3O<t_
5．陰極射線管、電子部件和發(fā)光管的玻璃內(nèi)的鉛含量； !H,nVzg~9
6．鋼中合金元素中的鉛含量達(dá)0.35%、鋁含量達(dá)0.4%，銅合金中的鉛含量達(dá)4%； (;? ''lT;
7．-- 高溫融化的焊料中的鉛（即：錫鉛焊料合金中鉛含量超過(guò)85%）； 7Y|[1]pnb/Y
-- 用于服務(wù)器、存儲(chǔ)器和存儲(chǔ)系統(tǒng)的焊料中的鉛（豁免準(zhǔn)予至2010年）； V}x[M1 yp[1]
-- 用于交換、信號(hào)和傳輸，以及電信網(wǎng)絡(luò)管理的網(wǎng)絡(luò)基礎(chǔ)設(shè)施設(shè)備中焊料中的鉛； i[D Kd
-- 電子陶瓷產(chǎn)品中的鉛（例如：高壓電子裝置）； c*!m,>Q@rt
8．根據(jù)修改關(guān)于限制特定危險(xiǎn)物質(zhì)和預(yù)制品銷(xiāo)售和使用的第76/769/EEC 號(hào)指令的第91/338/EEC 號(hào)指令禁止以外的鎘電鍍。 4I=u$ Z)j
9．在吸收式電冰箱中作為碳鋼冷卻系統(tǒng)防腐劑的六價(jià)鉻。 LoB,4#!)a
10．根據(jù)在第7（2）條中提及的程序，歐盟委員會(huì)應(yīng)評(píng)價(jià)以下方面的應(yīng)用： {1p
tc=k
-- 臺(tái)卡二苯醚（Deca BDE）； fJ$eL=]
[1]o
-- 特殊用途的直管日光燈中的汞； }8y0''
-- 以下用途中所使用的焊料中的鉛：服務(wù)器、存儲(chǔ)器、用于交換和傳輸?shù)木W(wǎng)絡(luò)基礎(chǔ)設(shè)施、電信網(wǎng)絡(luò)管理設(shè)備（旨在設(shè)定本指令豁免部分的特定截止時(shí)間）； 5VD[
>=
-- 燈泡。 C/#yf;?
kpR[1]N#@jK
J ` 8=L^
g7 +
2．一般用途的直管日光燈中的汞含量不得超過(guò)： YZ:2]
nH~
- 鹽磷酸鹽 10毫克 D &xOJII
- 正常的三磷酸鹽 5毫克 5;KV)#C2
- 長(zhǎng)效的三磷酸鹽 8毫克 0UCjB\D,G
3．特殊用途的直管日光燈中的汞含量； HaZ- jd9;
4．本附錄中未特別提及的其它照明燈中的汞含量； 4^xM3O<t_
5．陰極射線管、電子部件和發(fā)光管的玻璃內(nèi)的鉛含量； !H,nVzg~9
6．鋼中合金元素中的鉛含量達(dá)0.35%、鋁含量達(dá)0.4%，銅合金中的鉛含量達(dá)4%； (;? ''lT;
7．-- 高溫融化的焊料中的鉛（即：錫鉛焊料合金中鉛含量超過(guò)85%）； 7Y|[1]pnb/Y
-- 用于服務(wù)器、存儲(chǔ)器和存儲(chǔ)系統(tǒng)的焊料中的鉛（豁免準(zhǔn)予至2010年）； V}x[M1 yp[1]
-- 用于交換、信號(hào)和傳輸，以及電信網(wǎng)絡(luò)管理的網(wǎng)絡(luò)基礎(chǔ)設(shè)施設(shè)備中焊料中的鉛； i[D Kd
-- 電子陶瓷產(chǎn)品中的鉛（例如：高壓電子裝置）； c*!m,>Q@rt
8．根據(jù)修改關(guān)于限制特定危險(xiǎn)物質(zhì)和預(yù)制品銷(xiāo)售和使用的第76/769/EEC 號(hào)指令的第91/338/EEC 號(hào)指令禁止以外的鎘電鍍。 4I=u$ Z)j
9．在吸收式電冰箱中作為碳鋼冷卻系統(tǒng)防腐劑的六價(jià)鉻。 LoB,4#!)a
10．根據(jù)在第7（2）條中提及的程序，歐盟委員會(huì)應(yīng)評(píng)價(jià)以下方面的應(yīng)用： {1p
tc=k
-- 臺(tái)卡二苯醚（Deca BDE）； fJ$eL=]
[1]o
-- 特殊用途的直管日光燈中的汞； }8y0''
-- 以下用途中所使用的焊料中的鉛：服務(wù)器、存儲(chǔ)器、用于交換和傳輸?shù)木W(wǎng)絡(luò)基礎(chǔ)設(shè)施、電信網(wǎng)絡(luò)管理設(shè)備（旨在設(shè)定本指令豁免部分的特定截止時(shí)間）； 5VD[
>=
-- 燈泡。 C/#yf;?
kpR[1]N#@jK
J ` 8=L^
plastic-flanged reel - 帶塑料側(cè)板的線盤(pán) （0） 投訴
P:2006-10-27 16:19:53
5
第二批已經(jīng)確認(rèn)豁免 發(fā)表在2005年10月15日官方雜志上 `x|*K
]2aPsp #O
The Annex to Directive 2002/95/EC is amended as follows: C)7f5&]w(
1. The title is replaced by the following: QUk ->9
‘Applications of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) which are exempted from the requirements of Article 4(1)’; 8[1]YYiB;
o;ez@]''R
2. The following point 9a is added: PJ ?Dw<
‘9a. DecaBDE in polymeric applications;’ +p`
j}AQ ]
K[1]-(DK[
3. The following point 9b is added: ;-p!ohmI
‘9b. Lead in lead-bronze bearing shells and bushes’. }WGy;''
^=,y]SCRY
1． 標(biāo)題由下列內(nèi)容取代： !PV#B*N}
鉛、鎘、汞、六價(jià)鉻、PBB、PBDE的應(yīng)用根據(jù)需求被豁免： lr4QO)*-}
kXp)@n)VE
2． 在第9條中加入9a P~\zX
a]
聚合體中的十溴二苯醚的應(yīng)用 vZ*{k@}Vg
J%Rm<:#]
3． 在第9條中加入9b b
\eO8)Lo
鉛在鉛銅軸承外殼與襯套中 9|[]+n
]2aPsp #O
The Annex to Directive 2002/95/EC is amended as follows: C)7f5&]w(
1. The title is replaced by the following: QUk ->9
‘Applications of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) which are exempted from the requirements of Article 4(1)’; 8[1]YYiB;
o;ez@]''R
2. The following point 9a is added: PJ ?Dw<
‘9a. DecaBDE in polymeric applications;’ +p`
j}AQ ]
K[1]-(DK[
3. The following point 9b is added: ;-p!ohmI
‘9b. Lead in lead-bronze bearing shells and bushes’. }WGy;''
^=,y]SCRY
1． 標(biāo)題由下列內(nèi)容取代： !PV#B*N}
鉛、鎘、汞、六價(jià)鉻、PBB、PBDE的應(yīng)用根據(jù)需求被豁免： lr4QO)*-}
kXp)@n)VE
2． 在第9條中加入9a P~\zX
a]
聚合體中的十溴二苯醚的應(yīng)用 vZ*{k@}Vg
J%Rm<:#]
3． 在第9條中加入9b b
\eO8)Lo
鉛在鉛銅軸承外殼與襯套中 9|[]+n
anti-ferromagnetic steel - 抗鐵磁鋼 （0） 投訴
P:2006-10-27 16:21:14
6
第三批已經(jīng)確認(rèn)豁免 發(fā)表在2005年10月25日官方雜志上 _ }U({O
q#rfpdpHP"
1. point 7 is replaced by the following: I#C~k6g
%
7. — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead), 0"LeR1Qj
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, h)OSPL?
signalling, transmission as well as network management for telecommunications, [1]w|QVT^
— lead in electronic ceramic parts (e.g. piezoelectronic devices). R30wj9!2Z\
#=,&n^T`
2. point 8 is replaced by the following: IW`wL
3zg
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use ofcertain dangerous substances and preparations. Uu~E-L 7F
S？[am-8}
3. the following points are added: 8T|w^X(11). Lead used in compliant pin connector systems. n|Ul+`z_
(12). Lead as a coating material for the thermal conduction module c-ring. F;[ oCcf
(13). Lead and cadmium in optical and filter glass. df''vN
(14). Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. :dT"P=n-2
(15). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’ I Bi b9%>
R]2'';w]Q?Z
|! \ fh1z
1． 原文第7條由以下內(nèi)容取代 jc高溫融化型焊錫鉛（如：鉛含量≥85%的合金中的鉛） X}i(l[1]^
用于服務(wù)器，存儲(chǔ)器和存儲(chǔ)陣列的焊料中的鉛。用于交換、信號(hào)產(chǎn)生和傳輸，以及電信網(wǎng)絡(luò)管理的網(wǎng)絡(luò)基礎(chǔ)設(shè)施設(shè)備中焊料中的鉛。 F-[ -y^O
電子陶瓷部件中的鉛（如：piezoelectronic devices） QE%< J\}
2． 原文第8條由以下內(nèi)容取代 _pf{@h
j
電觸點(diǎn)中的鎘及鎘化合物以及91/338/EEC指令限制范圍以外的鎘電鍍層中的鎘 ~!T qdxg
_8/,D,
3． 以下條款將被添加
E^[0zP
（11）順應(yīng)針聯(lián)接系統(tǒng)中使用的鉛 KA%G[Q>vc
（12）熱導(dǎo)項(xiàng)槍釘模組涂層中所用的鉛 +？3"xmciw
（13）光學(xué)玻璃及濾光玻璃中所用的鉛及鎘 ABFX+F@
!
（14）微處理器針腳及封裝聯(lián)接所使用的含有80-85%鉛的復(fù)合（含有超過(guò)兩種組分）焊料中的鉛 FOzV4{s^.=
（15）倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛 `-{M`D| (
q#rfpdpHP"
1. point 7 is replaced by the following: I#C~k6g
%
7. — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead), 0"LeR1Qj
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, h)OSPL?
signalling, transmission as well as network management for telecommunications, [1]w|QVT^
— lead in electronic ceramic parts (e.g. piezoelectronic devices). R30wj9!2Z\
#=,&n^T`
2. point 8 is replaced by the following: IW`wL
3zg
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use ofcertain dangerous substances and preparations. Uu~E-L 7F
S？[am-8}
3. the following points are added: 8T|w^X
(12). Lead as a coating material for the thermal conduction module c-ring. F;[ oCcf
(13). Lead and cadmium in optical and filter glass. df''vN
(14). Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. :dT"P=n-2
(15). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’ I Bi b9%>
R]2'';w]Q?Z
|! \ fh1z
1． 原文第7條由以下內(nèi)容取代 jc
用于服務(wù)器，存儲(chǔ)器和存儲(chǔ)陣列的焊料中的鉛。用于交換、信號(hào)產(chǎn)生和傳輸，以及電信網(wǎng)絡(luò)管理的網(wǎng)絡(luò)基礎(chǔ)設(shè)施設(shè)備中焊料中的鉛。 F-[ -y^O
電子陶瓷部件中的鉛（如：piezoelectronic devices） QE%< J\}
j
電觸點(diǎn)中的鎘及鎘化合物以及91/338/EEC指令限制范圍以外的鎘電鍍層中的鎘 ~!T qdxg
_8/,D,
3． 以下條款將被添加
E^[0zP
（11）順應(yīng)針聯(lián)接系統(tǒng)中使用的鉛 KA%G[Q>vc
（12）熱導(dǎo)項(xiàng)槍釘模組涂層中所用的鉛 +？3"xmciw
（13）光學(xué)玻璃及濾光玻璃中所用的鉛及鎘 ABFX+F@
!
（14）微處理器針腳及封裝聯(lián)接所使用的含有80-85%鉛的復(fù)合（含有超過(guò)兩種組分）焊料中的鉛 FOzV4{s^.=
（15）倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛 `-{M`D| (
automatic leakage detection - 自動(dòng)查漏 （0） 投訴
P:2006-10-27 16:21:56
7
RoHS：進(jìn)一步豁免 2004年12月提交相關(guān)方咨詢(xún)2月11日止(正在審議中)： @n''Euk0
A further 22 proposed exemptions are under a Commission consultation, which closes on 11 February 2005: <3ra(~b''
1．Lead in tin whisker resistant coatings for fine pitch (<0.65 mm) applications (e.g. connectors). AtD{pyx.t
2．Lead bound in glass, crystal glass, lead crystal or full lead crystal in general. Tj )C^>8S
3．Chromium (VI) and cadmium as colouring agents (up to 2 % content) in glass, crystal glass, lead crystal or full lead crystal for decorative and/or functional use. 0meRpS8
4．Solders containing lead and/or cadmium for specific applications. 9'' _ q0g
5．Hexavalent chromium anti-corrosion coatings. _{m''wk%
6．Lead oxide glass in plasma display panels. Ar[
cmO8a
7．Lead in connectors, flexible printed circuits, flexible flat cables. ps
BJ
8．Lead glass used for magnetic heads (e.g. VCRs). R I(-IXO:7
9．Cadmium as a doping material in avalanche photodiodes (APDs) for optical fibre communications. oYo#[ .aN
10．Lead in optical isolators. ]g
,l/NF
11．Lead glass seals in the sheath heater of microwaves. [1]Op@{QnxT
12．Cadmium pigments (except for those banned by the Cadmium Directive 91/338/EEC.
6 b@ -d？^
13．Lead halide (iodide) as a radiant agent in high intensity discharge (HID) lamps for professional UV applications (e.g. lamps used for curing, reprography and label printing). [1]00R^W$/
14．Lead activators in the phosphors used for specialised straight and compact fluorescent lamps (e.g. lamps for sun tanning, diazo-printing, reprography, lithography, insect traps). 9V(QY$X？
15．Lead as an amalgam in discharge lamps (e.g. small compact energy-saving fluorescent lamps). ''vS-l
z
16．Lead in glass solder used for mercury-free flat panel lamps. Wg''lmyq?
17．Lead in the glass envelope of Black Light Blue (BLB) UV lamps (BLB lamps are used for money checking, leak detection, disco lighting etc). .l{ 1
18．Lead in low melting point alloys (e.g. second soldering operations on a printed circuit board (PCB) and safety and other temperature dependant switching devices. Tmv?%vK[1]
19．Lead in galvanised steel (up to 0.35% lead) and aluminium (up to 0.4 % unintended lead). BK`U"hhrA
20．Lead in solder and hexavalent chromium in surface treatments in parts recovered from non-household printers & copying equipment which were originally placed on the market before 1 July 2006, and are reused as part of the original equipment manufacturer’s closed loop system until 1 July 2011. YR &q&q[
21．Cadmium sulphide photocells. Dx:H83^2
22．Light sensors which mimic the human eye, such as daylight-responsive dimming systems for lighting. rib8LC`2
23．Aeronautic and aerospace sector applications that require high safety standards for any of the RoHS restricted substances. (Clarifying that EEE in these sectors is exempt from the RoHS Directive. Such EEE is excluded from the WEEE by falling outside the 10 WEEE categories.) %]d)
A further 22 proposed exemptions are under a Commission consultation, which closes on 11 February 2005: <3ra(~b''
1．Lead in tin whisker resistant coatings for fine pitch (<0.65 mm) applications (e.g. connectors). AtD{pyx.t
2．Lead bound in glass, crystal glass, lead crystal or full lead crystal in general. Tj )C^>8S
3．Chromium (VI) and cadmium as colouring agents (up to 2 % content) in glass, crystal glass, lead crystal or full lead crystal for decorative and/or functional use. 0meRpS8
4．Solders containing lead and/or cadmium for specific applications. 9'' _ q0g
5．Hexavalent chromium anti-corrosion coatings. _{m''wk%
6．Lead oxide glass in plasma display panels. Ar[
cmO8a
7．Lead in connectors, flexible printed circuits, flexible flat cables. ps
BJ
8．Lead glass used for magnetic heads (e.g. VCRs). R I(-IXO:7
9．Cadmium as a doping material in avalanche photodiodes (APDs) for optical fibre communications. oYo#[ .aN
10．Lead in optical isolators. ]g
,l/NF
11．Lead glass seals in the sheath heater of microwaves. [1]Op@{QnxT
12．Cadmium pigments (except for those banned by the Cadmium Directive 91/338/EEC.
6 b@ -d？^
13．Lead halide (iodide) as a radiant agent in high intensity discharge (HID) lamps for professional UV applications (e.g. lamps used for curing, reprography and label printing). [1]00R^W$/
14．Lead activators in the phosphors used for specialised straight and compact fluorescent lamps (e.g. lamps for sun tanning, diazo-printing, reprography, lithography, insect traps). 9V(QY$X？
15．Lead as an amalgam in discharge lamps (e.g. small compact energy-saving fluorescent lamps). ''vS-l
z
16．Lead in glass solder used for mercury-free flat panel lamps. Wg''lmyq?
17．Lead in the glass envelope of Black Light Blue (BLB) UV lamps (BLB lamps are used for money checking, leak detection, disco lighting etc). .l{ 1
18．Lead in low melting point alloys (e.g. second soldering operations on a printed circuit board (PCB) and safety and other temperature dependant switching devices. Tmv?%vK[1]
19．Lead in galvanised steel (up to 0.35% lead) and aluminium (up to 0.4 % unintended lead). BK`U"hhrA
20．Lead in solder and hexavalent chromium in surface treatments in parts recovered from non-household printers & copying equipment which were originally placed on the market before 1 July 2006, and are reused as part of the original equipment manufacturer’s closed loop system until 1 July 2011. YR &q&q[
21．Cadmium sulphide photocells. Dx:H83^2
22．Light sensors which mimic the human eye, such as daylight-responsive dimming systems for lighting. rib8LC`2
23．Aeronautic and aerospace sector applications that require high safety standards for any of the RoHS restricted substances. (Clarifying that EEE in these sectors is exempt from the RoHS Directive. Such EEE is excluded from the WEEE by falling outside the 10 WEEE categories.) %]d)
crane loading - 吊車(chē)裝盤(pán),吊車(chē)裝線盤(pán)(用吊車(chē)把空線盤(pán)裝上) （0） 投訴
P:2006-10-27 16:22:57
8
1． 小螺距應(yīng)用中在抗錫須涂料中的鉛 _？_ N
T
2． 玻璃、晶體玻璃、鉛晶體或全鉛晶體中的鉛 C ;FMQN
3． 在玻璃、晶體玻璃、鉛晶體或全鉛晶體中作為著色添加劑且含量達(dá)到2%的鉻（也包括六價(jià)鉻）和鎘，這些玻璃等作為電子電氣設(shè)備的裝飾性和/或功能性的一部分 \lKude5=&I
4． 特殊用途的焊料，含鉛和/或鎘 @* RNY:？
5． 六價(jià)鉻鈍化涂膜 24t$？69@
6． 氧化鉛玻璃等離子顯示板中的鉛 =j? M^%w
7． 連接器、柔性印刷電路、柔性扁平電纜中的鉛 e4B_\7}
8． 鉛化玻璃、磁頭的粘接材料及磁頭中的氧化鉛 V
xGym
9． 光纖通訊系統(tǒng)用雪崩二極管中作為攙雜材料的鎘 =T#_*su
10． 光隔離器中的鉛 $yx4qm7
11． 微波鎧裝加熱器中的鉛 `)==i^ @
12． 鎘顏料，除91/338/EEC指令（修訂76/769/EEC關(guān)于限制某些物質(zhì)的銷(xiāo)售和使用指令）禁止的應(yīng)用外 I>6.< !H
13． 專(zhuān)業(yè)紫外線應(yīng)用中的高強(qiáng)度放電燈，含有鹵化鉛作為輻射劑 ]J2^s5
14． 特殊用途的放電燈， 在熒光粉中含有鉛（重量比1%或以下）作為激活劑 u9;w&BCV
15． 放電燈，以汞齊劑形式含有鉛 .;
nkj5 6
16． 平板燈中的汞 7a/i$Uo~dY
17． 特殊用途紫外線燈，有玻璃外殼中含鉛 2.M%(8
HwQ
18． 含鉛的低熔點(diǎn)合金 m N# *R/B
19． 電子電氣設(shè)備中的電鍍鋼含鉛（重量比）達(dá)到0.35%，以及鋁作為雜質(zhì)的鉛含量達(dá)0.4%。 9`EG~o`+
20． 焊料中的鉛和表面處理中的六價(jià)鉻，以及在從打印機(jī)和復(fù)印設(shè)備中回收的部件中的鉛和六價(jià)鉻。這些部件是從專(zhuān)業(yè)用戶(hù)而不是私人家庭收回的，且是2006年7月1日前投放市場(chǎng)的，在原始制造商的閉環(huán)系統(tǒng)內(nèi)作為相同目的重新使用的。在這里，閉環(huán)系統(tǒng)是指，在該系統(tǒng)內(nèi)設(shè)備仍是制造商的財(cái)產(chǎn)，或者經(jīng)受其它的合同安排，且在合同到期或設(shè)備壽命終結(jié)時(shí)被返回給制造商。直到2011年7月1日。 >-6F#
Z^
21． 硫化鎘光電池 tT>9@ sL
22． 應(yīng)用在模擬假眼睛中的光感應(yīng)元件。 4p-">f>
23． 用在需要較高安全標(biāo)準(zhǔn)的航天和航空行業(yè)的電子電氣設(shè)備中的鉛、汞、鎘、六價(jià)鉻、PBB和PBDE. Wk{]&A
T
2． 玻璃、晶體玻璃、鉛晶體或全鉛晶體中的鉛 C ;FMQN
3． 在玻璃、晶體玻璃、鉛晶體或全鉛晶體中作為著色添加劑且含量達(dá)到2%的鉻（也包括六價(jià)鉻）和鎘，這些玻璃等作為電子電氣設(shè)備的裝飾性和/或功能性的一部分 \lKude5=&I
4． 特殊用途的焊料，含鉛和/或鎘 @* RNY:？
5． 六價(jià)鉻鈍化涂膜 24t$？69@
6． 氧化鉛玻璃等離子顯示板中的鉛 =j? M^%w
7． 連接器、柔性印刷電路、柔性扁平電纜中的鉛 e4B_\7}
8． 鉛化玻璃、磁頭的粘接材料及磁頭中的氧化鉛 V
xGym
9． 光纖通訊系統(tǒng)用雪崩二極管中作為攙雜材料的鎘 =T#_*su
10． 光隔離器中的鉛 $yx4qm7
11． 微波鎧裝加熱器中的鉛 `)==i^ @
12． 鎘顏料，除91/338/EEC指令（修訂76/769/EEC關(guān)于限制某些物質(zhì)的銷(xiāo)售和使用指令）禁止的應(yīng)用外 I>6.< !H
13． 專(zhuān)業(yè)紫外線應(yīng)用中的高強(qiáng)度放電燈，含有鹵化鉛作為輻射劑 ]J2^s5
14． 特殊用途的放電燈， 在熒光粉中含有鉛（重量比1%或以下）作為激活劑 u9;w&BCV
15． 放電燈，以汞齊劑形式含有鉛 .;
nkj5 6
16． 平板燈中的汞 7a/i$Uo~dY
17． 特殊用途紫外線燈，有玻璃外殼中含鉛 2.M%(8
HwQ
18． 含鉛的低熔點(diǎn)合金 m N# *R/B
19． 電子電氣設(shè)備中的電鍍鋼含鉛（重量比）達(dá)到0.35%，以及鋁作為雜質(zhì)的鉛含量達(dá)0.4%。 9`EG~o`+
20． 焊料中的鉛和表面處理中的六價(jià)鉻，以及在從打印機(jī)和復(fù)印設(shè)備中回收的部件中的鉛和六價(jià)鉻。這些部件是從專(zhuān)業(yè)用戶(hù)而不是私人家庭收回的，且是2006年7月1日前投放市場(chǎng)的，在原始制造商的閉環(huán)系統(tǒng)內(nèi)作為相同目的重新使用的。在這里，閉環(huán)系統(tǒng)是指，在該系統(tǒng)內(nèi)設(shè)備仍是制造商的財(cái)產(chǎn)，或者經(jīng)受其它的合同安排，且在合同到期或設(shè)備壽命終結(jié)時(shí)被返回給制造商。直到2011年7月1日。 >-6F#
Z^
21． 硫化鎘光電池 tT>9@ sL
22． 應(yīng)用在模擬假眼睛中的光感應(yīng)元件。 4p-">f>
23． 用在需要較高安全標(biāo)準(zhǔn)的航天和航空行業(yè)的電子電氣設(shè)備中的鉛、汞、鎘、六價(jià)鉻、PBB和PBDE. Wk{]&A
silane cured wire - 硅烷交聯(lián)電線 （0） 投訴
P:2006-10-27 16:23:47
9
RoHS：進(jìn)一步豁免 (正在審議中)： :t=:/-ZW
1 Linear incandescent lamp. 14(b？iq,
2 Mercury in switches. u3 Special ICs having tin-lead solder plating on leads used in professional equipment. V''clEFw
4 Specific modular units including tin-lead solder being used in special professional equipment. [jA#7fNl
5 Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours. \tc/''z <
6 Lead in solder for printed circuit boards for emergency lighting products. Y-L-/`E7 Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment. $|-R9-@
8 Lead in gas sensors. wK.Va?I(
9 Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) lamps in LCD TVs. tXGZ4?W
TW
10 Cadmium in opto-electronic components. $Q-U>k
11 Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation. )*A$S[1]B:
12 Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems. +J:5o]13 Cadmium-bearing copper alloys. r5
I[1]m~ e
14 Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools. t8ilX.qK
15 Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings – elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications. Uh2AC_#pj
16 Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and -c5?,Z+a
commercial loudspeakers. C b^SKFL
17 Cadmium oxide. c~*P''t+?
18 Solder tin of the thermo fuse with a defined low melting point. m-'' M(6
19 Lead in lead oxide glass used in plasma display panel (PDP). }C|{%
+8(
20 Lead in solder on small PCB and tinned legs of primary components. bdMuae6&
j
21 Use of the not lead free component NEC V25 in the Memor 2000. C ?
a^
22 Lead used in shielding of radiation for Non Medical X-ray equipment. 02T-jxZED
23 Lead based solders sealed or captured within heat-shrinkable components and devices. [1]
1 Linear incandescent lamp. 14(b？iq,
2 Mercury in switches. u
4 Specific modular units including tin-lead solder being used in special professional equipment. [jA#7fNl
5 Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours. \tc/''z <
6 Lead in solder for printed circuit boards for emergency lighting products. Y-L-/`E
8 Lead in gas sensors. wK.Va?I(
9 Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) lamps in LCD TVs. tXGZ4?W
TW
10 Cadmium in opto-electronic components. $Q-U>k
11 Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation. )*A$S[1]B:
12 Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems. +J:5o]
I[1]m~ e
14 Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools. t8ilX.qK
15 Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings – elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications. Uh2AC_#pj
16 Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and -c5?,Z+a
commercial loudspeakers. C b^SKFL
17 Cadmium oxide. c~*P''t+?
18 Solder tin of the thermo fuse with a defined low melting point. m-'' M(6
19 Lead in lead oxide glass used in plasma display panel (PDP). }C|{%
+8(
20 Lead in solder on small PCB and tinned legs of primary components. bdMuae6&
j
21 Use of the not lead free component NEC V25 in the Memor 2000. C ?
a^
22 Lead used in shielding of radiation for Non Medical X-ray equipment. 02T-jxZED
23 Lead based solders sealed or captured within heat-shrinkable components and devices. [1]
autobar - 棒材自動(dòng)供送裝置 （0） 投訴
P:2006-10-27 16:24:47
10
1．線性白熾燈 ''(N*y s
2．開(kāi)關(guān)中的汞 p&O%?YUEH
3．專(zhuān)業(yè)設(shè)備所用特殊IC引腳覆蓋的錫鉛焊料鍍層 >68 6Y9qJ
4． 含有錫鉛焊料的特殊模塊單元 \;8="X \
5． 含有鉛和/或鎘的焊料，應(yīng)用在溫度高于150攝氏度需要持續(xù)工作500小時(shí)的特殊設(shè)備中 B pt}!}8
6．應(yīng)急燈的PCB板的焊料中的鉛 9{`~/
R
7．用作表面處理的鉻酸鹽轉(zhuǎn)換料的六價(jià)鉻 ~W_AiT h[
8．氣體傳感器的鉛 u56!cv
9．紫藍(lán)燈管中的氧化鋁（密封玻璃中的鉛） +KAG_[-\O
10．光電部件中的鎘 Eh<_e`pke
11．非消費(fèi)目的的機(jī)械電力傳輸系統(tǒng)（包括用電子電氣部件控制安全和運(yùn)作的減速器和機(jī)械耦合器） rH2t？z$!
12．加熱通風(fēng)設(shè)備，空氣調(diào)節(jié)系統(tǒng)，商業(yè)用冷卻系統(tǒng)和運(yùn)輸用冷卻系統(tǒng)的電子電氣部件 %/sc\2@U
13．含鎘銅合金 7$2`p[Q]
m
14．包含電子電氣部件的移動(dòng)或固定空氣壓縮機(jī)的真空吸塵系統(tǒng)，壓縮空氣污染物清除系統(tǒng)以及氣動(dòng)工具 g"uF5T3C_
–高功率專(zhuān)業(yè)及商業(yè)用喇叭的傳感器的電子、機(jī)械焊料的鉛合金 u,"s3&-hYb
–以下用途的電子電氣設(shè)備：運(yùn)輸－航空、航天、陸、海、鐵路安裝到建筑物的－升降電梯、電動(dòng)扶梯、移動(dòng)帶、小型升降機(jī)、加熱、冷卻和通風(fēng)系統(tǒng)、防火安全系統(tǒng)、用于能源生產(chǎn)和傳送、用于采礦和礦物加工、非消費(fèi)商業(yè)用途的電力傳輸系統(tǒng)、工業(yè)加工泵和壓縮機(jī)、用于工業(yè)冰箱、用于軍功設(shè)施 W} qlUq
17．氧化鎘 Ff Nh''-4>b
18．低熔點(diǎn)熱熔絲的焊錫 ？
z`
^G
19．等離子顯示器中氧化鉛玻璃中的鉛 >x*#i}
20．小的PCB和鍍錫元件焊料中的鉛（紅外成像儀中） q''$)U!CgCL
21．Memor2000中非無(wú)鉛元件NEC25的使用 -!/_L}n(mD
22．非醫(yī)療用X射線設(shè)備中輻射防護(hù)部件中的鉛 Ow5jV\px 1
23．密封于熱收縮元件裝置中的鉛焊料 Z JM
2．開(kāi)關(guān)中的汞 p&O%?YUEH
3．專(zhuān)業(yè)設(shè)備所用特殊IC引腳覆蓋的錫鉛焊料鍍層 >68 6Y9qJ
4． 含有錫鉛焊料的特殊模塊單元 \;8="X \
5． 含有鉛和/或鎘的焊料，應(yīng)用在溫度高于150攝氏度需要持續(xù)工作500小時(shí)的特殊設(shè)備中 B pt}!}8
6．應(yīng)急燈的PCB板的焊料中的鉛 9{`~/
R
7．用作表面處理的鉻酸鹽轉(zhuǎn)換料的六價(jià)鉻 ~W_AiT h[
8．氣體傳感器的鉛 u5
9．紫藍(lán)燈管中的氧化鋁（密封玻璃中的鉛） +KAG_[-\O
10．光電部件中的鎘 Eh<_e`pke
11．非消費(fèi)目的的機(jī)械電力傳輸系統(tǒng)（包括用電子電氣部件控制安全和運(yùn)作的減速器和機(jī)械耦合器） rH2t？z$!
12．加熱通風(fēng)設(shè)備，空氣調(diào)節(jié)系統(tǒng)，商業(yè)用冷卻系統(tǒng)和運(yùn)輸用冷卻系統(tǒng)的電子電氣部件 %/sc\2@U
13．含鎘銅合金 7$2`p[Q]
m
14．包含電子電氣部件的移動(dòng)或固定空氣壓縮機(jī)的真空吸塵系統(tǒng)，壓縮空氣污染物清除系統(tǒng)以及氣動(dòng)工具 g"uF5T3C_
–高功率專(zhuān)業(yè)及商業(yè)用喇叭的傳感器的電子、機(jī)械焊料的鉛合金 u,"s3&-hYb
–以下用途的電子電氣設(shè)備：運(yùn)輸－航空、航天、陸、海、鐵路安裝到建筑物的－升降電梯、電動(dòng)扶梯、移動(dòng)帶、小型升降機(jī)、加熱、冷卻和通風(fēng)系統(tǒng)、防火安全系統(tǒng)、用于能源生產(chǎn)和傳送、用于采礦和礦物加工、非消費(fèi)商業(yè)用途的電力傳輸系統(tǒng)、工業(yè)加工泵和壓縮機(jī)、用于工業(yè)冰箱、用于軍功設(shè)施 W} qlUq
17．氧化鎘 Ff Nh''-4>b
18．低熔點(diǎn)熱熔絲的焊錫 ？
z`
^G
19．等離子顯示器中氧化鉛玻璃中的鉛 >x*#i}
20．小的PCB和鍍錫元件焊料中的鉛（紅外成像儀中） q''$)U!CgCL
21．Memor2000中非無(wú)鉛元件NEC25的使用 -!/_L}n(mD
22．非醫(yī)療用X射線設(shè)備中輻射防護(hù)部件中的鉛 Ow5jV\px 1
23．密封于熱收縮元件裝置中的鉛焊料 Z JM
